The important one is the difference between CPU core temp & reported "CPU diode" temp [winbond "PII Thermal diode" on a 6BA+IV].
+4.0C was originally measured/calculated as the combined CPU diode + motherboard compensation in the test system. A “worst-case” figure
for CPU diode compensation, taken from Intel’s "PIII Processor Thermal Design Guidelines" Page 44, is +4.8C.
MotherBoardMonitor 4.17 – which reads from the 6BA+IV’s integrated Winbond W83782D – had our above compensation applied to the “Winbond 2 PII Thermal Diode” & -1C applied
to “Winbond 1,” which was used here for a “motherboard” temperature. Ambient air & Air-intake temperatures were taken separately.
Since this test-series, we have recalibrated this motherboard with a remote sensor attached direct to the base of the CPU: the "CPU Diode" [Winbond PII thermal diode] reading
now has +6C & the "Motherboard" [Winbond 1] now has - 5C [compared to intake-air temperature] compensations applied in MBM to approximate true figures.
C/W is simply the difference between cpu core temperature & intake-air temperature in relation to watts: the figures we give in Table 3 have 2C added for absolute CPU core temp over
our original readings [shown in the screenshots]: the air-intake readings were accurate.